Stu Weinshanker

858-454-2149

Stu is well known in the Microelectronics Packaging community for his knowledge and expertise in materials and joining. He is unique in his ability to bridge the gap between engineering and marketing, turning concepts into reality. Professional experience includes sales, marketing, engineering and operations management positions at industry leading companies.

Jim Lawson

805-551-0792

Jim has a wealth of microelectronic packaging knowledge and expertise - hybrid microelectronics, LTCC, and semiconductors. His prior experience includes engineering/sales positions at BTL/Western Electric, Sperry Rand, ITT, Raytheon, CTS, CMAC, National Semiconductor and LTCC Science & Technology, and is a former President of IMAPS.

Stu (left) at Northrop Grumman, Woodland Hills

Jim (left) at Northrop Grumman, Woodland Hills