Advanced Packaging Associates

Click on logos below for more information

Specialists in precision laser machining and drilling of difficult applications (So Ca only)

Over 30 years of experience in multilayer ceramics:

Alumina (HTCC), Aluminum Nitride, BeO and LTCC

Thermal adhesives offering unmatched thermal conductivities, exceeding most common solders.

Novel and effective custom electronic packaging design and fabrication for a wide range of applications; Extensive library of engineering tools for custom modeling services.

Southern California based, short to medium run LTCC alumina substrate and package manufacturer

REMTEC
Combining Plated Copper Metallization with multiplayer Thick Films for Custom Metallized Ceramic Substrates, Chip Carriers, Hermetic Packages and Submounts.

Specialized sputtering and vapor deposition. Thin film metallization and optical coatings, development and manufacture of custom semiconductor and MEMs devices.

Custom lightweight thermal management solutions, based on a family of Spray Formed Controlled Expansion (“CE”) aluminum alloys.

Manufacturer of high reliability hermetic packages and windows for RF/Microwave, Fiber Optic, Detector, Power and Hybrid applications. Custom designs or choose from our thousands of standard tools. (So Ca, Az only)

Leader in the development and supply of advanced diamond products and services, related to thin-film and free-standing diamond deposition and other diamond materials.

APA also maintains relationships with several sources of high value solutions for:

ORGANIC SUBSTRATES - click here for further details

CONTRACT MICROELECTRONIC ASSEMBLY SERVICES

HOME – COMPANIES – TEAM – LINE CARD - PCB

Click on logos below for more information
	Specialists in precision laser machining and drilling of difficult applications (So Ca only)
	Over 30 years of experience in multilayer ceramics: Alumina (HTCC), Aluminum Nitride, BeO and LTCC
	Thermal adhesives offering unmatched thermal conductivities, exceeding most common solders.
	Novel and effective custom electronic packaging design and fabrication for a wide range of applications; Extensive library of engineering tools for custom modeling services.
	Southern California based, short to medium run LTCC alumina substrate and package manufacturer
REMTEC	Combining Plated Copper Metallization with multiplayer Thick Films for Custom Metallized Ceramic Substrates, Chip Carriers, Hermetic Packages and Submounts.
	Specialized sputtering and vapor deposition. Thin film metallization and optical coatings, development and manufacture of custom semiconductor and MEMs devices.
	Custom lightweight thermal management solutions, based on a family of Spray Formed Controlled Expansion (“CE”) aluminum alloys.
	Manufacturer of high reliability hermetic packages and windows for RF/Microwave, Fiber Optic, Detector, Power and Hybrid applications. Custom designs or choose from our thousands of standard tools. (So Ca, Az only)
	Leader in the development and supply of advanced diamond products and services, related to thin-film and free-standing diamond deposition and other diamond materials.